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I-EPLC6080 Precision Optical Fiber Laser Cutting Machine ye-PCB substrate
Umshini wokusika we-PCB substrate wokunemba we-fiber laser usetshenziselwa ikakhulukazi ukucutshungulwa kwe-laser microprocessing njengokusika, ukubhoboza, ukufaka uphawu, ukumaka namanye ama-PCB aluminium substrates, ama-substrates ethusi, nama-ceramic substrates.
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I-EPLC6045 Laser Cutting Machine ye-Precision Alloy Instruments
Umshini wokusika we-laser we-Precision alloy usetshenziswa ikakhulukazi i-laser micromachining yethusi, i-tungsten, i-titanium, i-zinc, i-magnesium, i-molybdenum, i-aluminium, i-nickel, uzibuthe, insimbi ye-silicon, i-powder metallurgy nezinye izinsimbi ze-alloy.
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Umshini Wokusika I-Laser wensimbi ye-Precision Steel Plane ECLC6080
Umshini wokusika i-laser wezinsimbi eziyisicaba zensimbi ezinembile usetshenziselwa ikakhulukazi i-laser micromachining yamathuluzi ahlukahlukene njengensimbi engagqwali ne-alloy eqinile ngaphambi nangemva kokwelashwa komhlaba.
