English

Izixazululo zedivayisi yezokwelapha

Umshini Wokusika I-Laser wezinsimbi ze-Medical Planar MPLC6045 Isithombe Esifakiwe
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045
  • Laser Cutting Machine for Medical Planar Instruments MPLC6045

Laser Cutting Machine for Medical Planar Instruments MPLC6045

Incazelo emfushane:

Umshini wokusika i-laser wemishini ye-medical planar usetshenziselwa ikakhulukazi i-laser micromachining yemishini yezokwelapha njengezingcezu zokulungisa ubuchopho, izingcezu zokuxhuma, izingcezu ze-electrode, njll.


  • Ububanzi bomthungo obuncane bokusika:15 ~ 30um
  • Ukunemba okuphezulu komshini:≤±10um
  • Ikhwalithi enhle yokusikwa:Awekho amaphethelo amabi, ukusikwa okubushelelezi
  • Ukusebenza kahle okuphezulu kokucubungula:okukodwa - ukusika odongeni oluseceleni, ukucubungula okuzenzakalelayo kokuphakelayo okuqhubekayo

    • Imininingwane Yomkhiqizo

    EzobuchwepheshePama-aramu:

     

    Isivinini sokusebenza esiphezulu 300mm/s(X1);100mm/s(X2);50mm/s(Y);50mm/s(Z);600rpm(θ)
    Ukunemba Kokumisa ±3um(X1);±5um(X2);±3um(Y); ±3um(Z);±15arcsec(θ)
    Ukunemba Kokuma Okuphindaphindayo ±1um(X1);±3um(X2);±1um(Y);±1um(Z);±3arcsec(θ)
    Ukusika Ububanzi Bomthungo 20um ~ 30um
    Izinto zokwakha I-304&316L&Ni-Ti&L605&Al&Gu&Li&Mg&Fe njll.
    Ishubhu ubude obungenalutho <2.5m (isakhiwo sokusekela singenziwa ngezifiso);
    Icubungula ukujiya kodonga 0~1.5±0.02 mm;
    Ibanga lokucubungula amapayipi Φ0.3~Φ7.5&Φ1.0~Φ16.0±0.02 mm;
    Ibanga lokucubungula indiza 200mm (300mm)*100mm;
    ukucubungula ububanzi 0～300mm&0 ~ 600mm (imikhiqizo emide ingacutshungulwa ngokuhlanganisa izigaba
    indlela);
    Ubude bezinto ezisele 60mm;
    Uhlobo lwe-laser I-fiber laser;
    Laser wavelength 1030-1070±10nm;
    amandla laser 200W&250W&300W&500W&1000W&QCW150W ngenketho;
    Ugesi wezisetshenziswa 220V± 10%, 50Hz;AC 25A (i-breaker circuit main);
    Ifomethi yefayela I-DXF&DWG&STP&IGS;
    Ubukhulu bemishini 1200mm(&1800mm)x1300mmx1750mm;
    Isisindo semishini 1500Kg;

    I-EPLC6045

    I-EPLC6045

    Ukuzivumelanisa nezimo okuqinile
    ① Ngokusika okomile nge-laser & ukusika okumanzi & ukubhoboza & slotting namanye amakhono amahle okwenza imishini
    ②Can umshini 304&316L&Ni-Ti&L605&Li&Mg&Al&Cu&Fe&Ceramic nezinye izinto
    ③Ingakwazi ukundiza ngomshini nezinsimbi ezingaphezulu ezigobile
    ④Nikeza indawo ekabili & indawo yokubona komshini nokwamukela nokuvala isikhala nokulayisha okuzenzakalelayo nokulayisha isistimu nokuqapha okunamandla neminye imisebenzi efanayo.
    ⑤Ihlonyiswe ngekhanda eliqondile lokusika le-laser elizithuthukisayo ende nelifushane elibukhali neliyisicaba futhi lihambisana nekhanda lokusika le-laser elitholakala ngokuthengiswayo.
    ⑥Ifakwe nge-2D & 2.5D nesistimu yesofthiwe ye-3D CAM yokuzithuthukisa ye-laser micromachining
    Landela umqondo wokuklama we-ergonomics, uthambile futhi umfushane
    Ububanzi bohlelo lokusebenza:
    I-laser micromachining yezinsimbi zokuhlinza nezamathambo ezifana ne-endoscope eqinile & i-ultrasonic scalpel & endoscope& stapler & idivayisi ye-suture & umshini othambile & iplanethi & nenaliti yokubhoboza & i-nose drill
    Ukunemba okuphezulu kwemishini:
    ①Ububanzi bomthungo wokusika omncane: 18~30um
    ②Ukunemba okuphezulu komshini: ≤ ± 10um
    ③Ikhwalithi enhle yokusika: ayikho i-burr & i-incision ebushelelezi
    ④Ukusebenza kahle kwemishini: ukusika kanye nje odongeni lweshubhu eseceleni kanye nomshini wokuphakelayo oqhubekayo oqhubekayo

    KOKO

    Umklamo oguquguqukayo
    ①Landela umqondo wokuklama we-ergonomics, uthambile futhi umfushane
    ②Nikeza umsebenzi ozikhethela wesistimu yombono womshini ngesikhathi sangempela ku-inthanethi ukuqapha inqubo yemishini ye-laser ashukumisayo
    ③Isofthiwe nemisebenzi yezingxenyekazi zekhompuyutha ifanelana ngokuguquguqukayo, isekela ukucushwa komsebenzi okwenziwe kwaba ngokwakho nokuphathwa kokukhiqiza okuhlakaniphile
    ④Sekela phambili idizayini eqanjiwe ukusuka kuleveli yengxenye ukuya kuleveli yesistimu
    ⑤Isilawuli sohlobo oluvulekile nesistimu yesoftware ye-laser micromachining kulula ukuyisebenzisa nesixhumi esibonakalayo esibonakalayo

  • Okwedlule:
  • Olandelayo:
    • Bhala umlayezo wakho lapha futhi usithumelele wona

    Izindaba ezihlobene

    Chofoza u-enter ukuze useshe noma u-ESC ukuze uvale