I-laser enembile

I-EPLC6080 Precision Optical Fiber Laser Cutting Machine ye-PCB substrate

Incazelo emfushane:

Umshini wokusika we-PCB substrate wokunemba we-fiber laser usetshenziselwa ikakhulukazi ukucutshungulwa kwe-laser microprocessing njengokusika, ukubhoboza, ukufaka uphawu, ukumaka namanye ama-PCB aluminium substrates, ama-substrates ethusi, nama-ceramic substrates.


  • Ububanzi be-seam encane yokusika:20 ~ 40um
  • Ukunemba okuphezulu komshini :≤±10um
  • Ikhwalithi enhle yokusikwa:ukusika okubushelelezi, indawo encane ethintekile ekushiseni, i-burr encane kanye nokusika umphetho
  • Ukulungiswa kosayizi:ubuncane bosayizi womkhiqizo ngu-20um
  • Imininingwane Yomkhiqizo

    I-PCB Substrate Precision Fiber Laser Cutting Machine

    Umshini wokusika we-PCB substrate wokunemba we-fiber laser usetshenziselwa ikakhulukazi ukwenza i-laser microprocessing njengokusika kwe-laser, ukubhoboza nokubhala ama-substrates e-PCB ahlukahlukene, okungabhekiselwa kuwo njengomshini wokusika we-PCB laser okwesikhashana.Okufana nokusika nokwakhiwa kwe-PCB aluminium substrate, ukusika nokwenza i-substrate yethusi, ukusika nokwakheka kwe-ceramic substrate, ukwakheka kwe-laser ye-copper substrate ethayiwe, ukusika nokwakheka kwe-chip, njll.

    Amapharamitha wobuchwepheshe:

    Isivinini esikhulu sokusebenza 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s(Z);
    Ukumisa ukunemba ±3um (X) ±3um (Y1&Y2) ;±5um (Z);
    Ukunemba kokuma okuphindaphindiwe ±lum (X) ;±lum(Y1&Y2) ;±3um(Z);
    Izinto zokwakha ukunemba kwensimbi engagqwali, insimbi eyingxubevange eqinile nezinye izinto ngaphambi noma ngemva kokwelashwa kwendawo
    Ukujiya kodonga olubalulekile 0~2.0±0.02mm;
    Ibanga lomshini wendiza 600mm * 800mm; (ukusekelwa ngokwezifiso kwezidingo zefomethi ezinkulu)
    Uhlobo lwe-laser I-fiber laser;
    Laser wavelength 1030-1070±10nm;
    amandla laser I-CW1000W&CW2000W&QCW150W&QCW450W&QCW750W ngenketho;
    Ugesi wezisetshenziswa 220V± 10%, 50Hz;AC 30A (i-breaker circuit main);
    Ifomethi yefayela DXF, DWG;
    Ubukhulu bemishini 1750mm*1850mm*1600mm;
    Isisindo semishini 1800Kg;

    Umbukiso oyisampula:

    isithombe7

    Ububanzi bohlelo lokusebenza
    I-Laser micromachining yendiza kanye nezinsimbi ezingaphezulu ezigobile zensimbi engagqwali enembile kanye ne-alloy eqinile ngaphambi noma ngemva kokwelashwa kwendawo

    Ukunemba okuphezulu kwemishini
    Ububanzi be-seam encane yokusika: 20 ~ 40um
    1 Ukunemba okuphezulu komshini: ≤ ± 10um
    Ikhwalithi enhle yokusika: ukusika okushelelayo & indawo encane ethintekile ekushiseni kanye ne-burr encane
    Ukulungiswa kosayizi: usayizi omncane womkhiqizo ngu-100um

    Ukuzivumelanisa nezimo okuqinile
    Iba nekhono lokusika i-laser, ukubhola, ukumaka nokunye ukwenza kahle kwe-PCB substrate
    Ingakwazi umshini i-PCB aluminium substrate, i-copper substrate, i-ceramic substrate nezinye izinto
    1 Ifakwe iplathifomu yokunyakaza eqondile ye-direct-drive yeselula ezithuthukisiwe, iplatifomu yegwadle kanye nokucushwa kwe-shafting evaliwe
    1 Ihlinzeka ngokuma okukabili & ukuma okubukwayo kanye nesistimu yokulayisha nokukhipha okuzenzakalelayo neminye imisebenzi ongayikhetha
    1 Ifakwe i-vacuum adsorption clamping fixture eyakhiwe ngokwezifiso nemojula yokuhlukanisa uthuli lwe-slag kanye nesistimu yepayipi lokususa uthuli kanye nohlelo lokuphepha oluvikela ukuqhuma.
    1 Ifakwe i-2D & 2.5D kanye nesistimu yesofthiwe ye-CAM ezithuthukisayo ye-laser micromachining

    Umklamo oguquguqukayo
    Landela umqondo wokuklama we-ergonomics, uthambile futhi umfushane
    1 Ukuhlanganiswa kwesofthiwe eguquguqukayo nomsebenzi wezingxenyekazi zekhompiyutha, okusekela ukucushwa komsebenzi ongokwezifiso nokuphathwa kokukhiqiza okuhlakaniphile
    1 Sekela idizayini yokuqamba emisha kusukela ezingeni lengxenye kuya ezingeni lesistimu
    1 Isilawuli esivulekile nesistimu yesoftware ye-laser micromachining okulula ukuyisebenzisa nesixhumi esibonakalayo esinembile

    Isitifiketi sobuchwepheshe
    ngo-CE
    I-ISO9001
    I-IATF16949


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