I-PCB Substrate Precision Fiber Laser Cutting Machine
Umshini wokusika we-PCB substrate wokunemba we-fiber laser usetshenziselwa ikakhulukazi ukwenza i-laser microprocessing njengokusika kwe-laser, ukubhoboza nokubhala ama-substrates e-PCB ahlukahlukene, okungabhekiselwa kuwo njengomshini wokusika we-PCB laser okwesikhashana.Okufana nokusika nokwakhiwa kwe-PCB aluminium substrate, ukusika nokwenza i-substrate yethusi, ukusika nokwakheka kwe-ceramic substrate, ukwakheka kwe-laser ye-copper substrate ethayiwe, ukusika nokwakheka kwe-chip, njll.
Amapharamitha wobuchwepheshe:
Isivinini esikhulu sokusebenza | 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s(Z); |
Ukumisa ukunemba | ±3um (X) ±3um (Y1&Y2) ;±5um (Z); |
Ukunemba kokuma okuphindaphindiwe | ±lum (X) ;±lum(Y1&Y2) ;±3um(Z); |
Izinto zokwakha | ukunemba kwensimbi engagqwali, insimbi eyingxubevange eqinile nezinye izinto ngaphambi noma ngemva kokwelashwa kwendawo |
Ukujiya kodonga olubalulekile | 0~2.0±0.02mm; |
Ibanga lomshini wendiza | 600mm * 800mm; (ukusekelwa ngokwezifiso kwezidingo zefomethi ezinkulu) |
Uhlobo lwe-laser | I-fiber laser; |
Laser wavelength | 1030-1070±10nm; |
amandla laser | I-CW1000W&CW2000W&QCW150W&QCW450W&QCW750W ngenketho; |
Ugesi wezisetshenziswa | 220V± 10%, 50Hz;AC 30A (i-breaker circuit main); |
Ifomethi yefayela | DXF, DWG; |
Ubukhulu bemishini | 1750mm*1850mm*1600mm; |
Isisindo semishini | 1800Kg; |
Umbukiso oyisampula:
Ububanzi bohlelo lokusebenza
I-Laser micromachining yendiza kanye nezinsimbi ezingaphezulu ezigobile zensimbi engagqwali enembile kanye ne-alloy eqinile ngaphambi noma ngemva kokwelashwa kwendawo
Ukunemba okuphezulu kwemishini
Ububanzi be-seam encane yokusika: 20 ~ 40um
1 Ukunemba okuphezulu komshini: ≤ ± 10um
Ikhwalithi enhle yokusika: ukusika okushelelayo & indawo encane ethintekile ekushiseni kanye ne-burr encane
Ukulungiswa kosayizi: usayizi omncane womkhiqizo ngu-100um
Ukuzivumelanisa nezimo okuqinile
Iba nekhono lokusika i-laser, ukubhola, ukumaka nokunye ukwenza kahle kwe-PCB substrate
Ingakwazi umshini i-PCB aluminium substrate, i-copper substrate, i-ceramic substrate nezinye izinto
1 Ifakwe iplathifomu yokunyakaza eqondile ye-direct-drive yeselula ezithuthukisiwe, iplatifomu yegwadle kanye nokucushwa kwe-shafting evaliwe
1 Ihlinzeka ngokuma okukabili & ukuma okubukwayo kanye nesistimu yokulayisha nokukhipha okuzenzakalelayo neminye imisebenzi ongayikhetha
1 Ifakwe i-vacuum adsorption clamping fixture eyakhiwe ngokwezifiso nemojula yokuhlukanisa uthuli lwe-slag kanye nesistimu yepayipi lokususa uthuli kanye nohlelo lokuphepha oluvikela ukuqhuma.
1 Ifakwe i-2D & 2.5D kanye nesistimu yesofthiwe ye-CAM ezithuthukisayo ye-laser micromachining
Umklamo oguquguqukayo
Landela umqondo wokuklama we-ergonomics, uthambile futhi umfushane
1 Ukuhlanganiswa kwesofthiwe eguquguqukayo nomsebenzi wezingxenyekazi zekhompiyutha, okusekela ukucushwa komsebenzi ongokwezifiso nokuphathwa kokukhiqiza okuhlakaniphile
1 Sekela idizayini yokuqamba emisha kusukela ezingeni lengxenye kuya ezingeni lesistimu
1 Isilawuli esivulekile nesistimu yesoftware ye-laser micromachining okulula ukuyisebenzisa nesixhumi esibonakalayo esinembile
Isitifiketi sobuchwepheshe
ngo-CE
I-ISO9001
I-IATF16949