Izicelo eziyisithupha ze-laser esheshayo ekwenziweni okunembayo komkhakha we-elekthronikhi yabathengi

Izicelo eziyisithupha ze-laser esheshayo ekwenziweni okunembayo komkhakha we-elekthronikhi yabathengi

Ngokuthuthuka okusheshayo kwemboni ye-elekthronikhi yabathengi, imikhiqizo ye-elekthronikhi yabathengi ithuthukela ekuhlanganisweni okuphezulu kanye nokunemba okuphezulu.Izingxenye zangaphakathi zemikhiqizo ye-elekthronikhi ziya ziba zincane futhi zibe zincane, futhi izidingo zokunemba nokuhlanganiswa kwe-elekthronikhi ziya ngokuya ziba phezulu.Ukuthuthukiswa kobuchwepheshe obuphambili bokukhiqiza i-laser kulethe izixazululo ezidingweni zokucubungula ngokunemba kwemboni ye-elekthronikhi.Uma sithatha inqubo yokukhiqiza omakhalekhukhwini njengesibonelo, ubuchwepheshe bokucubungula i-laser bungene ekusikeni isikrini, ukusika amalensi ekhamera, ukumaka uphawu, ukushisela ingxenye yangaphakathi nezinye izinhlelo zokusebenza.“KuSemina ka-2019 mayelana nokusetshenziswa kobuchwepheshe be-laser obuphambili bokukhiqiza embonini”, ochwepheshe besayensi nezobuchwepheshe baseNyuvesi yaseTsinghua kanye ne-Shanghai Institute of Optics and Mechanics ye-Chinese Academy of Sciences baqhube ingxoxo ejulile mayelana nokusetshenziswa kwamanje kwe ukukhiqizwa kwe-laser okuthuthukisiwe ekucutshungulweni okunembayo kwemikhiqizo ye-elekthronikhi yabathengi.

Manje ake ngikuyise ukuze uhlaziye izinhlelo zokusebenza eziyisithupha ze-laser esheshayo ekucutshungulweni okunembayo kwemboni yezogesi zabathengi:
I-1.I-Ultra fast laser ultra-fine special ukukhiqiza: i-ultra fast laser micro nano processing iwubuchwepheshe bokukhiqiza obukhethekile obukhethekile, obungakwazi ukucubungula izinto ezikhethekile ukuze kuzuzwe izakhiwo ezikhethekile kanye nezindawo ezithile zokubona, zikagesi, ezomshini nezinye.Nakuba lobu buchwepheshe bungasenakuncika ezintweni zokwakha amathuluzi, bunweba izinhlobo zezinto ezicutshungulwayo, futhi bunezinzuzo zokungagugi nokuguqulwa.Ngesikhathi esifanayo, kukhona nezinkinga okufanele zixazululwe futhi zithuthukiswe, njengokulethwa kwamandla kanye nokusetshenziswa kahle, amandla e-laser kanye nokukhethwa kwe-wavelength yokumunca, ukunemba kwendawo yokulethwa, ukumodela kwamathuluzi, ukucubungula ukusebenza kahle nokunemba."USolwazi sunhongbo waseTsinghua University ukholelwa ukuthi ukukhiqizwa kwe-laser kusabuswa amathuluzi akhethekile, futhi ukukhiqizwa kwe-macro kanye ne-micro nano kwenza imisebenzi yabo ngokulandelanayo. Esikhathini esizayo, ukukhiqizwa okukhethekile kwe-laser okukhethekile kunamandla amakhulu okuthuthuka ekuqondeni kwe-organic flexible electronics, isikhala. izingxenye ze-optical nokudluliswa kwesifanekiso, ama-quantum chips namarobhothi e-nano. Isiqondiso sesikhathi esizayo sokuthuthukiswa kokukhiqizwa kwe-laser esheshayo kuzoba ubuchwepheshe obuphezulu, imikhiqizo ephezulu eyengeziwe, futhi sizame ukuthola impumelelo embonini."
I-2.Hundred watt ultrafast fiber lasers kanye nezicelo zabo: eminyakeni yamuva, i-ultrafast fiber lasers isetshenziswe kabanzi ku-electronics yabathengi, amandla amasha, ama-semiconductors, ezokwelapha kanye nezinye izinkambu ezinemiphumela yazo eyingqayizivele yokucubungula.Kuhlanganisa ukusetshenziswa kwe-ultrafast fiber laser emikhakheni emihle ye-micromachining efana nebhodi lesifunda eliguquguqukayo, isibonisi se-OLED, ibhodi le-PCB, ukusikwa kwe-anisotropic kwesikrini sefoni ephathekayo, njll. Imakethe ye-laser esheshayo ingenye yezimakethe ezikhula ngokushesha endaweni ekhona ye-laser.Kulinganiselwa ukuthi isamba semakethe ye-laser ye-ultrafast izodlula ama-dollar ayizigidi eziyizinkulungwane ezimbili ngo-2020. Njengamanje, inkambiso yemakethe ingama-laser wesimo esiqinile, kodwa ngokwanda kwamandla we-pulse of ultrafast fiber lasers, isabelo I-ultrafast fiber lasers izokhula kakhulu.Ukuvela kwesilinganiso esiphakeme sama-lasers we-ultrafast fiber amakhulu kuno-150 W kuzosheshisa ukunwetshwa kwemakethe yama-laser asheshayo, kanti ama-lasers angu-1000 W kanye ne-MJ femtosecond azongena kancane kancane emakethe.
3.Ukusetshenziswa kwe-laser esheshayo ekucutshungulweni kwengilazi: ukuthuthukiswa kobuchwepheshe be-5g kanye nokukhula ngokushesha kwesidingo esibulalayo kukhuthaza ukuthuthukiswa kwamadivayisi we-semiconductor nobuchwepheshe bokupakisha, futhi kubeka phambili izidingo eziphakeme zokusebenza kahle nokunemba kokucubungula ingilazi.Ubuchwepheshe bokucubungula i-laser obusheshayo bungaxazulula izinkinga ezingenhla futhi bube yisinqumo sekhwalithi ephezulu yokucubungula ingilazi esikhathini esingu-5g.
4.Ukusetshenziswa kwe-laser ngokunemba ukusika embonini ye-elekthronikhi: ukusebenza okuphezulu kwe-fiber laser kungenza i-laser cutting esheshayo futhi enembayo ephezulu, ukubhoboza kanye nokunye umshini we-laser micro ngokusho kwemidwebo yokuklama yokunemba kwensimbi encane enezindonga ezilinganayo ipayipi elilingana nobubanzi futhi ipayipi elimise okukhethekile, kanye nokusikwa kwendiza eqondile yefomethi encane.Eyokugcina iyisisetshenziswa se-laser micromachining esinesivinini esikhulu futhi esinembayo esikhethekile esisebenza ngokunemba izinsimbi ezinodonga oluncanyana, ezingacubungula insimbi engagqwali, ingxubevange ye-aluminium, ingxubevange yethusi, i-tungsten, i-molybdenum, i-lithium, i-magnesium aluminium alloy, izitsha zobumba nezinye izinto zendiza. evame ukusetshenziswa emkhakheni wezinsimbi zikagesi.
5.Ukusetshenziswa kwe-laser esheshayo ekucutshungulweni kwesikrini esimise okukhethekile: i-iphonex ivule inkambiso entsha yesikrini esiphelele esimise okukhethekile, yaphinde yakhuthaza inqubekelaphambili eqhubekayo nokuthuthukiswa kobuchwepheshe bokusika isikrini esimise okukhethekile.U-Zhu Jian, umphathi womnyango webhizinisi we-Han we-laser kanye ne-semiconductor, wethule ubuchwepheshe be-Han obuzimele obuthuthukisiwe be-icicles diffraction free beam.Ubuchwepheshe buthatha uhlelo lokuqala lwe-optical, olungenza amandla asakazwe ngokulinganayo futhi aqinisekise ikhwalithi ehambisanayo yesigaba sokusika;Yamukela isikimu sokuhlukanisa esizenzakalelayo;Ngemva kokusikwa kwesikrini se-LCD, akukho ukuchaphaza kwezinhlayiyana endaweni, futhi ukunemba kokusika kuphezulu (<20 μ m) Umphumela wokushisa ophansi (<50 μ m) Kanye nezinye izinzuzo.Lobu buchwepheshe bufanele ukucutshungulwa kwesibuko esingaphansi, ukusika ingilazi encane, ukubhoboza isikrini se-LCD, ukusika ingilazi yemoto kanye nezinye izinkambu.
I-6.Ubuchwepheshe kanye nokusetshenziswa kwe-laser printing conductive circuits ebusweni be-ceramic materials: izinto ze-ceramic zinezinzuzo eziningi, ezifana ne-conductivity ephezulu ye-thermal, i-dielectric engaguquki, izakhiwo ezinamandla zemishini, ukusebenza kahle kwe-insulation nokunye.Kancane kancane ziye zathuthuka zaba i-substrate yokupakisha efanelekile yesizukulwane esisha samasekethe ahlanganisiwe, amasekethe amamojula we-semiconductor kanye namamojula kagesi kagesi.Ubuchwepheshe bokupakisha bebhodi le-Ceramic circuit nabo buye bakhathazeka kakhulu futhi bathuthukiswa ngokushesha.Ubuchwepheshe obukhona bokukhiqiza ibhodi lesifunda se-ceramic bunokushiyeka okuthile, okufana nemishini ebizayo, umjikelezo omude wokukhiqiza, ukungaguquguquki okwanele kwe-substrate, okukhawulela ukuthuthukiswa kobuchwepheshe obuhlobene namadivayisi.Ngakho-ke, ukuthuthukiswa kobuchwepheshe bokukhiqiza ibhodi lesifunda se-ceramic kanye nemishini enamalungelo empahla yengqondo ezimele kubaluleke kakhulu ukuthuthukisa izinga lobuchwepheshe laseShayina kanye nokuncintisana okuyinhloko emkhakheni wokukhiqiza ngogesi.


Isikhathi sokuthumela: Jul-08-2022

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