Isixazululo se-Precision 3c
ECLC6045 Precision Laser Cutting Machine for Hard Brittle Materials
Imingcele Yezobuchwepheshe
| Isivinini sokusebenza esiphezulu | 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s(Z); |
| Ukumisa ukunemba | ±3um (X) ±3um (Y1&Y2) ;±5um (Z); |
| Ukunemba kokuma okuphindaphindiwe | ±lum (X) ;±lum(Y1&Y2) ;±3um(Z）； |
| Izinto zokwakha | I-Alumina & zirconia & i-aluminium nitride & i-silicon nitride & Idayimane & I-Sapphire & Silicon & gallium arsenide & tungsten steel, njll; |
| Ukujiya kodonga olubalulekile | 0~2.0±0.02mm; |
| Ibanga lomshini wendiza | 300mm * 300mm; (ukusekela ngokwezifiso izidingo ezinkulu zefomethi) |
| Uhlobo lwe-laser | I-fiber laser; |
| Laser wavelength | 1030-1070±10nm; |
| amandla laser | I-CW1000W&QCW150W&QCW300W&QCW450W inketho |
| Ugesi wezisetshenziswa | 220V± 10%, 50Hz;AC 20A (i-breaker circuit main); |
| Ifomethi yefayela | DXF, DWG; |
| Ubukhulu bemishini | 1280mm*1320mm*1600mm; |
| Isisindo semishini | 1500Kg; |
Isampula Exhibition
Ububanzi bohlelo lokusebenza
1 I-Laser micromachining ye-ceramics, isafire, idayimane nensimbi ye-calcium, ukuqina okuphezulu nendiza ephukayo nezinsimbi ezivamile ezigobile
Ukunemba okuphezulu kwemishini
Ububanzi be-seam encane yokusika: 15 ~ 30um
1 Ukunemba okuphezulu komshini: ≤ ± 10um
Ikhwalithi enhle yokusika: ukusikwa okubushelelezi, indawo encane ethintekile ekushiseni, i-burr encane kanye ne-edge chipping ＜ 15um
Ukulungiswa kosayizi: usayizi omncane womkhiqizo ngu-100um
Ukuzivumelanisa nezimo okuqinile
1.Iba nekhono lokusika i-laser, ukubhola, ukufaka uphawu, ukumaka namanye amakhono amahle okucubungula indiza nezinsimbi ezingaphezulu ezigobile
2.Can umshini i-alumina, i-zirconia, i-aluminium nitride, i-silicon nitride, idayimane, isafire, i-silicon, i-gallium arsenide nensimbi ye-tungsten
3.Ifakelwe iplatifomu yedrayivu eqondile ezithuthukisiwe yeselula ephindwe kabili, iplatifomu yegwadle, i-aluminium alloy granite beam ukuze ikhethwe
4.Nikeza umsebenzi ozikhethela wona, njengesiteshi esiphindwe kabili & Ukuma Okubukwayo & ukuphakela okuzenzakalelayo kanye nesistimu yokuthulula kanye nokuqapha okunamandla njll.
5.Ihlonyiswe ngobude bokugxila obude nobufushane obuzithuthukisile, umlomo wombhobho ocijile kanye nekhanda lokusika le-laser eliyisicaba
6.Ifakwe nge-modular yokwamukela impahla kanye nohlelo lwamapayipi okukhipha uthuli
7.Nikeza ngohlaka lwe-tension oluzithuthukelayo olunyakazayo kanye nozimele we-tension ogxilile & i-vacuum adsorption & ne-honeycomb plate, njll. ongakukhetha
8.Ihlonyiswe ngohlelo lwesoftware oluzithuthukisele lwe-2D & 2.5D & 3D CAM lwe-laser micromachining
Umklamo oguquguqukayo
1.Landela umqondo wokuklama we-ergonomics, uthambile futhi ufushane
2.Isoftware eguquguqukayo nomsebenzi wehardware, isekela ukucushwa komsebenzi okwenziwe okomuntu siqu kanye nokuphathwa kokukhiqiza okuhlakaniphile
3.Sekela idizayini yokuqamba emisha kusuka ezingeni lengxenye kuya ezingeni lesistimu
4.Open control & laser micromachining software uhlelo lula ukusebenza & interface enembile
Isitifiketi sobuchwepheshe
ngo-CE
I-ISO9001
I-IATF16949
