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Isixazululo se-Precision 3c

I-ECLC6045 Precision Laser Cutting Machine Yezinto Eziqinile Ze-Brittle Isithombe Esifakiwe
  • ECLC6045 Precision Laser Cutting Machine for Hard Brittle Materials
  • ECLC6045 Precision Laser Cutting Machine for Hard Brittle Materials
  • ECLC6045 Precision Laser Cutting Machine for Hard Brittle Materials

ECLC6045 Precision Laser Cutting Machine for Hard Brittle Materials

Incazelo emfushane:

Umshini wokusika we-laser oqondile wezinto eziqinile neziphukayo usetshenziselwa ikakhulukazi i-laser micromachining yobulukhuni obuphezulu nezinto eziphezulu eziphukayo, njenge-ceramics, isafire, idayimane, insimbi ye-calcium, insimbi ye-tungsten, i-aluminium nitride, i-silicon nitride, i-gallium arsenide nezinye izinto.


  • Ububanzi bomthungo obuncane bokusika:15 ~ 35um
  • Ukunemba okuphezulu komshini:≤±10um
  • Ikhwalithi enhle yokusikwa:Ukusika okushelelayo, indawo encane ethintekile ekushiseni, i-burr encane kanye nokusika umphetho ＜ 15um
  • Ukulungiswa kosayizi:ubuncane bosayizi womkhiqizo ngu-100um

    • Imininingwane Yomkhiqizo

    Umshini wokusika we-laser onembile wezinto eziqinile neziqinile

    Umshini wokusika we-laser oqinile futhi ophukayo uwuhlobo lomshini wokusika we-laser onembile, osetshenziselwa ukusika, ukubhola, ukufaka, ukubhala kanye nokunye umshini we-laser micromachining wendiza eqinile nephukayo noma izinto ezisetshenziswayo ezijwayelekile, njengokwakhiwa kwendandatho yewashi ye-MIM, Iselula. Ukwakhiwa kwekhava ye-ceramic engemuva, ukufakwa kwepuleti le-ceramic, ukumba isafire, ukusika nokwenza amashidi ensimbi ye-tungsten, ukubhala nge-zirconia ceramic kanye nokwakhiwa kokubhoboza, njll. Izinto zokusebenza zithuthuke kakhulu ngomklamo, zifakwe uhlelo lwe-software ye-CNC evulekile, zisebenzisa ubuchwepheshe bokuthuthukiswa kokusebenza kwe-modular, okushunyekiwe. Umtapo wolwazi we-laser wobuchwepheshe bokucubungula kanye nohlelo lokulawula ukunyakaza kwama-axis amaningi, oluvuleleke kakhulu, ukuzinza okuhle nokusebenza okulula.

     

    Imingcele Yezobuchwepheshe

    Isivinini esikhulu sokusebenza 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s(Z);
    Ukumisa ukunemba ±3um (X) ±3um (Y1&Y2) ;±5um (Z);
    Ukunemba kokuma okuphindaphindiwe ±lum (X) ;±lum(Y1&Y2) ;±3um(Z）；
    Izinto zokwakha I-Alumina & zirconia & aluminium nitride & i-silicon nitride & Idayimane &
    I-Sapphire & Silicon & gallium arsenide & tungsten steel, njll;
    Ukujiya kodonga olubalulekile 0~2.0±0.02mm;
    Ibanga lomshini wendiza 300mm * 300mm; (ukusekela ngokwezifiso izidingo ezinkulu zefomethi)
    Uhlobo lwe-laser I-fiber laser;
    Laser wavelength 1030-1070±10nm;
    amandla laser I-CW1000W&QCW150W&QCW300W&QCW450W inketho
    Ugesi wezisetshenziswa 220V± 10%, 50Hz;AC 20A (i-breaker circuit main);
    Ifomethi yefayela DXF, DWG;
    Ubukhulu bemishini 1280mm*1320mm*1600mm;
    Isisindo semishini 1500Kg;

    Isampula Exhibition

    I-ECLC6045-2Ububanzi bohlelo lokusebenza

    1 I-Laser micromachining ye-ceramics, isafire, idayimane nensimbi ye-calcium, ukuqina okuphezulu nendiza ephukayo nezinsimbi ezivamile ezigobile

    Ukunemba okuphezulu kwemishini

    Ububanzi be-seam encane yokusika: 15 ~ 30um

    1 Ukunemba okuphezulu komshini: ≤ ± 10um

    Ikhwalithi enhle yokusika: ukusikwa okubushelelezi, indawo encane ethintekile ekushiseni, i-burr encane kanye ne-edge chipping ＜ 15um

    Ukulungiswa kosayizi: usayizi omncane womkhiqizo ngu-100um

    Ukuzivumelanisa nezimo okuqinile

    1.Iba nekhono lokusika i-laser, ukubhola, ukufaka uphawu, ukumaka namanye amakhono amahle okucubungula indiza nezinsimbi ezingaphezulu ezigobile

    2.Can umshini i-alumina, i-zirconia, i-aluminium nitride, i-silicon nitride, idayimane, isafire, i-silicon, i-gallium arsenide nensimbi ye-tungsten

    3.Ifakwe iplatifomu yedrayivu eqondile ezithuthukisiwe yeselula ephindwe kabili, iplatifomu yegwadle, i-aluminium alloy granite beam ukuze ikhethwe

    4.Nikeza umsebenzi ozikhethela wona, njengesiteshi esiphindwe kabili & Ukuma Okubukwayo & ukuphakela okuzenzakalelayo kanye nesistimu yokuthulula kanye nokuqapha okunamandla njll.

    5.Ihlonyiswe ngobude bokugxila obude nobufushane obuzithuthukisile, umlomo wombhobho ocijile kanye nekhanda lokusika le-laser eliyisicaba

    6.Ifakwe nge-modular yokwamukela impahla kanye nohlelo lwamapayipi okukhipha uthuli

    7.Nikeza ngohlaka lwe-tension oluzithuthukelayo olunyakazayo kanye nozimele we-tension ogxilile & i-vacuum adsorption & ne-honeycomb plate, njll. ongakukhetha

    8.Ihlonyiswe ngohlelo lwesoftware oluzithuthukisele lwe-2D & 2.5D & 3D CAM lwe-laser micromachining

    Umklamo oguquguqukayo

    1.Landela umqondo wokuklama we-ergonomics, uthambile futhi ufushane

    2.Isoftware eguquguqukayo nomsebenzi wehardware, isekela ukucushwa komsebenzi okwenziwe okomuntu siqu kanye nokuphathwa kokukhiqiza okuhlakaniphile

    3.Sekela idizayini yokuqamba emisha kusuka ezingeni lengxenye kuya ezingeni lesistimu

    4.Open control & laser micromachining software uhlelo lula ukusebenza & interface enembile

    Isitifiketi sobuchwepheshe

    ngo-CE

    I-ISO9001

    I-IATF16949

  • Okwedlule:
  • Olandelayo:
    • Bhala umlayezo wakho lapha futhi usithumelele wona

    Izindaba ezihlobene

    Chofoza u-enter ukuze useshe noma u-ESC ukuze uvale