Yiziphi izimboni zezicelo zemishini yokusika i-laser enembile

Ukuze uqonde imboni yesicelo somshini wokusika i-laser, ake siqale sifunde ukuthi isebenza kanjani?Iumshini wokusika we-laserisebenzisa i-laser beam engabonakali esikhundleni sommese oyimishini wokusika.Akukhona nje kuphela ukuthi isivinini sokusika sishesha futhi ukunemba kuphezulu, kodwa iphethini yokusika ayisekho ngaphansi kwanoma yimiphi imingcele.bushelelezi.Ingxenye yemishini yekhanda le-laser cutter ayinakho ukuthintana nendawo yokusebenza, ngakho-ke ngeke ibangele imihuzuko ebusweni bomsebenzi.Ngenxa yejubane layo lokusika ngokushesha kanye nendawo encane yokuxhumana, indawo ethintekile ukushisa incane, ukuguqulwa kwepuleti kuncane, futhi akukho ukulungiswa okulandelayo okudingekayo.Ngenxa yezinzuzo ezingenakuqhathaniswa zale mimese yemishini, imishini yokusika i-laser isetshenziswa kabanzi ezimbonini eziningi.

1. Isicelo embonini yemishini yezokwelapha

Imishini yokusika ye-laser enembile isetshenziswa kakhulu ezimbonini zezokwelapha ezifana nemishini yezokwelapha engenelelayo, okokusebenza kwe-endoscopic Bending Section, okokuhlinza, okokuhlinza kwamathambo.Okufana nenhliziyo, i-valve stent, i-stent ephansi, i-intracranial thrombectomy stent, i-hypotube stent, i-spiral tube stent, i-brain fixation stent, i-urinary cobra bone, i-biliary cobra bone, i-gastrointestinal cobra bone, i-anorectal cobra bone Ukucutshungulwa kwethambo nezinye izinsimbi kanye imishini yezokwelapha engeyona eyensimbi.

2. Isicelo embonini yesekethe ehlanganisiwe ye-semiconductor

Imishini yokusika i-laser enembileisetshenziswa kabanzi ekusikeni nasekwakheni ingxubevange yensimbi ehlukahlukene njengamadivayisi kagesi e-3C abathengi, abathwali be-semiconductor electroplating, ama-PCB substrates;njengokwenza ipuleti le-nickel elingemuva lesembozo sefoni ephathekayo, ukusika isakhiwo se-MIM, ukwenza indandatho yewashi, ukusika amashidi kazibuthe, ukwakheka kwe-alloy Microstructure, ukubhola kwesafire, ukusika nokwenza kwakheka i-silicon substrate sheet, ukusika nokwenza i-aluminium substrate, ukusika nokwenza i-chip, ukusika i-substrate yethusi. kanye nokwakha, izingxenye zesakhiwo ukusika nokwenza, ukusika nokubumba amashidi ethusi, njll. I-laser micromachining yamadivayisi ahlukahlukene ayisicaba futhi agobile.

3. Isicelo ngokunemba 3C kanye auto izingxenye umkhakha

Umshini wokusika we-laser onembile usetshenziswa kabanzi ekubholeni ngobumba, isithando somlilo se-electroplating, ishidi lensimbi engagqwali, ishidi lensimbi ye-silicon, ishidi lengxubevange ye-zinc nezinye izinto zokusika nokwenza, njenge-flat curved surface aluminium alloy speaker mesh, ukubhoboza inkinobho yekhibhodi, ishidi lensimbi engagqwali ngemva kwalokho. I-PVD, Ukusika i-Laser nokubhoboza izingxenye ezifana ne-snowflake imbobo eyenziwe yesikwele somsindo namashubhu ayindilinga, izimbobo zamahedsethi, amanetha ensingo, ubuso bekhoni, izimbobo zamandandatho, izimbobo ezincane ze-notebook shaft, njll.

Kukhona izicelo ezengeziwe zemishini yokusika i-laser enembayo kanye nezimboni eziyinkimbinkimbi.Ngokuzayo, ngokuthuthukiswa okuqhubekayo kobuchwepheshe bemishini ye-laser, izosetshenziswa ekucubunguleni izingxenye ezinembayo.Inkampani yethu ayihlinzeki nje kuphela ngazo zonke izinhlobo zemishini ye-laser enembayo, kodwa futhi inikeza izixazululo zenkinga zokuma okukodwa zokucubungula insimbi ngokunemba.Uma unezidingo zokucubungula imishini ye-laser, ungaxhumana nathi!