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Umshini Wokusika I-UV Laser Isithombe Esifakiwe
  • Umshini wokusika i-UV Laser

Umshini wokusika i-UV Laser

Incazelo emfushane:

Umshini wokusika i-Ultraviolet laser usetshenziselwa ikakhulukazi ukunemba kwe-laser micromachining njengokusika i-laser, ukubhola, ukubhala, ukuqoshwa okuyimpumputhe, njll. kwezindawo ezigobile noma eziyisicaba njengamabhodi e-PCB, amakhamera, namamojula wokuqaphela izigxivizo zeminwe.


  • Ububanzi bomthungo obuncane bokusika:15 ~ 30um
  • Ukunemba okuphezulu komshini:≤±15um
  • Ikhwalithi enhle yokusikwa:ukusika okubushelelezi, indawo encane ethintekile ekushiseni, i-burr encane kanye nokusika umphetho
  • Ukulungiswa kosayizi:ubuncane bosayizi womkhiqizo ngu-20um

    • Imininingwane Yomkhiqizo

    Umshini wokusika we-UV laser
    Umshini wokusika i-Ultraviolet laser usetshenziselwa ikakhulukazi ukuhlukaniswa kwe-laser ye-PCB kanye nokubhola, ikhamera, imojula yokuqaphela izigxivizo zeminwe ye-FPC ukusika, ukuvulwa kwefasitela lefilimu yekhava yebhodi elithambile neliqinile, ukwembula nokunquma, ishidi lensimbi ye-silicon, ukubhala kweshidi le-ceramic, izinto ezihlanganisiwe ze-ultra-thin. kanye ne-Copper foil, i-aluminium foil &, i-carbon fiber, i-glass fiber, i-Pet, i-PI nokunye ukucutshungulwa kwe-laser.Okujwayelekile njengokusika nokwenza i-antenna ye-foil ye-copper, ukusika nokwenza ibhodi le-PCB, ukusika nokwenza i-FPC, ukusika nokwakheka kwe-fiber yengilazi, ukusika nokwenza ifilimu, ukwenza uphenyo olufakwe ngegolide, njll.

    Amapharamitha wobuchwepheshe:

    Isivinini esikhulu sokusebenza 500mm/s (X);500mm/s (Y1Y2);50mm/s(Z);
    Ukumisa ukunemba ±3um(X)±3um(Y1Y2);±3um(Z);
    1Ukuma okuphindaphindayo kunembile ±1um(X);±1um(Y1Y2);±1um(Z);
    1Impahla yomshini I-FPC & PCB & PET & PI & nefoil yethusi & i-aluminium foil & carbon fibre & glass fibre & composite material & ceramic nezinye izinto
    Ukujiya kodonga olubalulekile 0~1.0±0.02mm;
    Ibanga lomshini wendiza 400mm * 350mm;
    Uhlobo lwe-laser I-UV fiber laser;
    1Laser wavelength 355±5nm;
    1 Amandla e-laser I-Nanosecond & picosecond, 10W & 15W ngenketho
    1 Imvamisa ye-laser 10~300KHz
    1 Ukuqina kwamandla < ± 3% (ukusebenza okuqhubekayo amahora angu-12);
    1 Ukunikezwa kwamandla 220V±10%,50Hz/60Hz;AC 20A(i-breaker circuit)
    1 Ifomethi yefayela DXF, DWG & Gebar;
    Ubukhulu 1200mm*1400mm*1800mm
    Isisindo semishini 1500Kg;

    Umbukiso oyisampula:

    isithombe10

    Ububanzi bohlelo lokusebenza
    PCB laser ukwahlukanisa & ukubhoboza;Imojula yokuhlonza ikhamera nezigxivizo zeminwe ye-FPC;Ukumboza amafasitela efilimu & ukwembula nokusikwa kwepuleti le-bonding eliqinile nelithambile;I-Silicon steel sheet & Ceramic Scribing;Izinto ezihlanganisiwe ezincanyana kakhulu ne-copper foil & i-aluminium foil & ne-carbon fibre & glass fiber & ne-Pet & PI laser cutting machining.

    Ukunemba okuphezulu kwemishini
    Ububanzi be-seam encane yokusika: 15 ~ 35um
    1 Ukunemba okuphezulu komshini ≤ 10um
    Ikhwalithi enhle yokusika: ukusika okushelelayo & indawo encane ethintekile ekushiseni kanye ne-burr encane
    Ukulungiswa kosayizi: ubuncane bosayizi womkhiqizo 50um

    Ukuzivumelanisa nezimo okuqinile
    1 Iba nekhono lokusika i-laser, ukubhola, ukubhala, ukuqopha okungaboni kanye nobunye ubuchwepheshe bomshini obuhle bendiza nezinsimbi ezivamile ezigobile.
    1 Ingakwazi umshini i-FPC & PCB & PET & PI & ne-copper foil & aluminium foil & carbon fibre & glass fiber & composite material & ceramic nezinye izinto
    1 Nikeza idrayivu eqondile ezithuthukisiwe yohlobo lwe-XY superposition kanye nohlobo oluhlukanisiwe lweplathifomu yokunyakaza eqondile ye-gantry kanye nesistimu yokulayisha nokulayishwa okuzenzakalelayo ukuze uthole inketho
    Ukuhlinzeka ngomsebenzi wokuskena kwangaphambili kwendawo yombono ye-CCD yamazwe amabili kanye nokubamba okuzenzakalelayo kwethagethi kanye nendawo
    Ifakwe i-adsorption ye-vacuum enembile kanye nesistimu yamapayipi okukhipha uthuli
    1 Ifakwe nohlelo lwesoftware oluzithuthukisele lwe-2D & 2.5D CAM lwe-laser micromachining

    Umklamo oguquguqukayo
    Landela umqondo wokuklama we-ergonomics, inhle futhi imfushane
    1 Inhlanganisela yesofthiwe nemisebenzi ye-hardware iyavumelana nezimo, isekela ukumiswa komsebenzi okuqondene nomuntu kanye nokuphathwa kokukhiqiza okuhlakaniphile.
    1 Sekela ukwakheka okuhle nokusungulayo kusuka ezingeni lengxenye kuya ezingeni lesistimu
    1 Isilawuli sohlobo esivulekile, isistimu yesoftware ye-laser micro-machining, kulula ukuyisebenzisa nesixhumi esibonakalayo esinembile

    Isitifiketi sobuchwepheshe
    ngo-CE
    I-ISO9001
    I-IATF16949

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